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Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors

Pappacena, K. E. and Faber, K. T. and Wang, H. and Porter, W. D. (2007) Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors. Journal of the American Ceramic Society, 90 (9). pp. 2855-2862. ISSN 0002-7820.

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Biomorphic silicon carbide (bioSiC), a novel porous ceramic derived from natural wood precursors, has potential applicability at high temperatures, particularly when rapid temperature changes occur. The thermal conductivity of bioSiC from five different precursors was experimentally determined using flash diffusivity and specific heat measurements at temperatures ranging from room temperature to 1100°C. The results were compared with values obtained from object-oriented finite-element analysis (OOF). OOF was also used to model and understand the heat-flow paths through the complex bioSiC microstructures.

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Faber, K. T.0000-0001-6585-2536
Additional Information:© 2007 The American Ceramic Society. Manuscript No. 22840. Received February 23, 2007; Approved March 31, 2007; Article first published online: 2 AUG 2007. This work is financially supported by the National Science Foundation Grant DMR- 0244258. This material is based upon work supported under a National Science Foundation Graduate Research Fellowship. A portion of the research was sponsored by the Assistant Secretary for Energy Efficiency and Renewable Energy, Office of Transportation Technologies, as part of the High-Temperature Materials Laboratory User Program, Oak Ridge National Laboratory, managed by UT-Battelle LLC, for the U.S. Department of Energy under contract number DE-AC05- 00OR22725. NUANCE Center is supported by NSF-NSEC, NSF-MRSEC, Keck Foundation, the State of Illinois, and Northwestern University. The SEM work was performed in the EPIC facility of NUANCE Center at Northwestern University. The authors would also like to acknowledge Vikram Kaul (Northwestern University), Edwin R. Fuller, Jr., and Stephen A. Langer (National Institute of Standards and Technology) for their assistance with OOF.
Funding AgencyGrant Number
NSF Graduate Research FellowshipUNSPECIFIED
Oak Ridge National LaboratoryUNSPECIFIED
Department of Energy (DOE)DE-AC05-00OR22725
Keck FoundationUNSPECIFIED
State of IllinoisUNSPECIFIED
Northwestern UniversityUNSPECIFIED
Issue or Number:9
Record Number:CaltechAUTHORS:20140715-130040547
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Official Citation:Pappacena, K. E., Faber, K. T., Wang, H. and Porter, W. D. (2007), Thermal Conductivity of Porous Silicon Carbide Derived from Wood Precursors. Journal of the American Ceramic Society, 90: 2855–2862. doi: 10.1111/j.1551-2916.2007.01777.x
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:47226
Deposited By: Joanne McCole
Deposited On:15 Jul 2014 22:26
Last Modified:03 Mar 2020 13:01

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