CaltechAUTHORS
  A Caltech Library Service

Evaporative cooling in microfluidic channels

Maltezos, George and Rajagopal, Aditya and Scherer, Axel (2006) Evaporative cooling in microfluidic channels. Applied Physics Letters, 89 (7). Art. No. 074107. ISSN 0003-6951. doi:10.1063/1.2234318. https://resolver.caltech.edu/CaltechAUTHORS:MALapl06

[img]
Preview
PDF
See Usage Policy.

307kB
[img]
Preview
Cover Image (JPEG)
See Usage Policy.

8kB
[img]
Preview
Other (JPEG)
See Usage Policy.

38kB
[img]
Preview
Other (JPEG)
See Usage Policy.

29kB
[img]
Preview
Other (JPEG)
See Usage Policy.

12kB

Use this Persistent URL to link to this item: https://resolver.caltech.edu/CaltechAUTHORS:MALapl06

Abstract

Evaporative cooling is an effective and energy efficient way to rapidly remove heat from a system. Specifically, evaporative cooling in microfluidic channels can provide a cost-effective solution for the cooling of electronic devices and chemical reactors. Here we present microfluidic devices fabricated by using soft-lithography techniques to form simple fluidic junctions between channels carrying refrigerant and channels carrying N2 gas. The effects of channel geometry and delivery pressure on the performance of refrigeration through vaporization of acetone, isopropyl alcohol, and ethyl ether were characterized. By varying gas inlet pressures, refrigerants, and angles of the microfluidic junctions, optimal cooling conditions were found. Refrigeration rates in excess of 40 °C/s were measured, and long lasting subzero cooling in the junction could be observed.


Item Type:Article
Related URLs:
URLURL TypeDescription
https://doi.org/10.1063/1.2234318DOIUNSPECIFIED
Additional Information:©2006 American Institute of Physics (Received 29 March 2006; accepted 19 June 2006; published online 18 August 2006) The authors would like to thank Alvaro Gomez for helping them realize the initial setup of the experiment, and Michael David Henry for thought provoking discussions. This project was supported by generous grants from the National Science Foundation Center for Nano-chemical-electrical Mechanical Manufacturing Systems (NSF-CEMMS) under DMI-0328162 and from the BOEING company under the Multifunctional NanoSystem Technologies program. Two of the authors (G.M. and A.R.) Contributed equally to this research.
Subject Keywords:evaporation; cooling; microfluidics; soft lithography; refrigerants
Issue or Number:7
DOI:10.1063/1.2234318
Record Number:CaltechAUTHORS:MALapl06
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:MALapl06
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:4813
Collection:CaltechAUTHORS
Deposited By: Archive Administrator
Deposited On:08 Sep 2006
Last Modified:08 Nov 2021 20:20

Repository Staff Only: item control page