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Effect of microstructure on high-temperature compressive creep of self-reinforced hot-pressed silicon nitride

Boling-Risser, Martha A. and Goretta, K. C. and Routbort, J. L. and Faber, K. T. (2000) Effect of microstructure on high-temperature compressive creep of self-reinforced hot-pressed silicon nitride. Journal of the American Ceramic Society, 83 (12). pp. 3065-3069. ISSN 0002-7820. http://resolver.caltech.edu/CaltechAUTHORS:20140908-181323692

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Abstract

An experimental self-reinforced hot-pressed silicon nitride was used to examine the effects of microstructure on high-temperature deformation mechanisms during compression testing. At 1575–1625°C, the as-received material exhibited a stress exponent of 1 and appeared to deform by steady-state grain-boundary sliding accommodated by solution-reprecipitation of silicon nitride through the grain-boundary phase. The activation energy was 610 6 110 kJ/mol. At 1450–1525°C for the as-received material, and at 1525–1600°C for the larger-grained heat-treated samples, the stress exponent was >1. Damage, primarily in the form of pockets of intergranular material at two-grain junctions, was observed in these samples.


Item Type:Article
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http://dx.doi.org/10.1111/j.1151-2916.2000.tb01683.xDOIArticle
http://onlinelibrary.wiley.com/doi/10.1111/j.1151-2916.2000.tb01683.x/abstractPublisherArticle
Additional Information:© 2000 The American Ceramic Society. Manuscript No. 189354. Received May 7, 1999; approved June 22, 2000. Based in part on the thesis submitted by M. A. Boling-Risser for the Ph.D. degree in materials science and engineering, Northwestern University, Evanston, Illinois, 1998. This research was supported by the U.S. Department of Energy, and by Argonne National Laboratory’s Division of Educational Programs, under Contract No. W-31-109-ENG-38. Thanks are extended to Alek Pyzik of Dow Chemical USA, who provided the material for this research and arranged for the postprocessing heat treatments. Thanks to Nestor Zaluzec at Argonne National Laboratory for performing the XEDS experiments, to Craig Sperry for assistance in monitoring the experiments, and to Antonio R. de Arellano-López for his assistance in reviewing the manuscript.
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Funding AgencyGrant Number
Department of Energy (DOE)W-31-109-ENG-38
Record Number:CaltechAUTHORS:20140908-181323692
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20140908-181323692
Official Citation:Boling-Risser, M. A., Goretta, K. C., Routbort, J. L. and Faber, K. T. (2000), Effect of Microstructure on High-Temperature Compressive Creep of Self-Reinforced Hot-Pressed Silicon Nitride. Journal of the American Ceramic Society, 83: 3065–3069. doi: 10.1111/j.1151-2916.2000.tb01683.x
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:49396
Collection:CaltechAUTHORS
Deposited By: George Porter
Deposited On:09 Sep 2014 20:24
Last Modified:09 Sep 2014 20:24

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