Steyer, Todd E. and Faber, K. T. and Drory, Michael D. (1995) Fracture strength of free‐standing chemically vapor‐deposited diamond films. Applied Physics Letters, 66 (23). pp. 3105-3107. ISSN 0003-6951. doi:10.1063/1.113617. https://resolver.caltech.edu/CaltechAUTHORS:20140908-181327215
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Abstract
The fracture strength of free‐standing chemically vapor‐deposited diamond films was assessed by four‐point bending. A two‐parameter Weibull analysis was performed on 130 μm thick films resulting in a Weibull modulus of 4.3 and a statistical scaling stress of 626 MPa. The residual stress in films was measured from the free‐standing film curvature to be 384±10 MPa. The fracture surface chemistry was examined using scanning Auger spectroscopy. The fracture did not occur preferentially along grain boundaries.
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Additional Information: | © 1995 American Institute of Physics. (Received 11 October 1994; accepted for publication 18 March 1995). The authors wish to thank D. Spaulding and Y.-W. Chung for their assistance in scanning Auger spectroscopy analysis. Support of this work was provided by the National Science Foundation under Grant No. DMR-9023629 for T.E.S. and K.T.F. and Grant No. III-9360024 for M.D.D. | |||||||||
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Issue or Number: | 23 | |||||||||
DOI: | 10.1063/1.113617 | |||||||||
Record Number: | CaltechAUTHORS:20140908-181327215 | |||||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20140908-181327215 | |||||||||
Official Citation: | Fracture strength of free‐standing chemically vapor‐deposited diamond films Steyer, Todd E. and Faber, K. T. and Drory, Michael D., Applied Physics Letters, 66, 3105-3107 (1995), DOI:http://dx.doi.org/10.1063/1.113617 | |||||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
ID Code: | 49425 | |||||||||
Collection: | CaltechAUTHORS | |||||||||
Deposited By: | George Porter | |||||||||
Deposited On: | 10 Sep 2014 15:59 | |||||||||
Last Modified: | 10 Nov 2021 18:44 |
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