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Microcrack Toughening in a SiC-TiB_2 Composite

Cai, H. and Gu, W.-H. and Faber, K. T. (1990) Microcrack Toughening in a SiC-TiB_2 Composite. In: Proceedings of the American Society for Composites Fifth Technical Conference : composite materials in transition. Technomic Publishing , Lancaster, PA, pp. 892-901. ISBN 0877627673. https://resolver.caltech.edu/CaltechAUTHORS:20140917-175220552

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Abstract

Transmission electron microscopy observations of a fractured SiC-TiB_2 composite have provided conclusive evidence of stress-induced microcracking in this system. The microcrack density parameter around a steadily growing crack has been measured as a function of the distance from the crack plane. Microcrack toughening in this system has been assessed using a discrete model based on the measured microcrack density parameter. The computation results indicate that nearly half of the toughening arises from stress-induced microcracking. Other possible toughening mechanisms are also discussed.


Item Type:Book Section
Alternate Title:Microcrack Toughening in a SiC-TiB2 Composite
Additional Information:© 1990 Technomic Publishing. This work was supported by the National Science Foundation under Grant No. DMR-8896212. Materials used in this study were graciously provided by The Carborundum Co., Niagara Falls, NY.
Funders:
Funding AgencyGrant Number
NSFDMR-8896212
Carborundum CompanyUNSPECIFIED
Record Number:CaltechAUTHORS:20140917-175220552
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20140917-175220552
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:49800
Collection:CaltechAUTHORS
Deposited By: George Porter
Deposited On:18 Sep 2014 20:03
Last Modified:03 Oct 2019 07:17

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