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Thermoelectric Transport in Cu_7PSe_6 with High Copper Ionic Mobility

Weldert, Kai S. and Zeier, Wolfgang G. and Day, Tristan W. and Panthöfer, Martin and Snyder, G. Jeffrey and Tremel, Wolfgang (2014) Thermoelectric Transport in Cu_7PSe_6 with High Copper Ionic Mobility. Journal of the American Chemical Society, 136 (34). pp. 12035-12040. ISSN 0002-7863. http://resolver.caltech.edu/CaltechAUTHORS:20140929-073134297

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Abstract

Building on the good thermoelectric performances of binary superionic compounds like Cu_2Se, Ag_2Se and Cu_2S, a better and more detailed understanding of phonon-liquid electron-crystal (PLEC) thermoelectric materials is desirable. In this work we present the thermoelectric transport properties of the compound Cu_7PSe_6 as the first representative of the class of argyrodite-type ion conducting thermoelectrics. With a huge variety of possible compositions and high ionic conductivity even at room temperature, the argyrodites represent a very good model system to study structure–property relationships for PLEC thermoelectric materials. We particularly highlight the extraordinary low thermal conductivity of Cu_7PSe_6 below the glass limit, which can be associated with the molten copper sublattice leading to a softening of phonon modes.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1021/ja5056092DOIArticle
http://pubs.acs.org/doi/abs/10.1021/ja5056092PublisherArticle
ORCID:
AuthorORCID
Snyder, G. Jeffrey0000-0003-1414-8682
Alternate Title:Thermoelectric Transport in Cu7PSe6 with High Copper Ionic Mobility
Additional Information:© 2014 American Chemical Society. Received: June 4, 2014. Publication Date (Web): July 24, 2014. Financial support through the Excellence Initiative (DFG/GSC 266) is acknowledged by K.W. We acknowledge support from the DFG priority program SPP1386 “Nanostructured Thermoelectrics”. T. W. Day and G. J. Snyder acknowledge support from the U.S. Air Force Office of Scientific Research. We gratefully thank David Brown (CalTech) for fruitful discussions.
Funders:
Funding AgencyGrant Number
Excellence InitiativeDFG/GSC 266
DFG priority programSPP1386
Air Force Office of Scientific Research (AFOSR)UNSPECIFIED
Record Number:CaltechAUTHORS:20140929-073134297
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20140929-073134297
Official Citation: Thermoelectric Transport in Cu7PSe6 with High Copper Ionic Mobility Kai S. Weldert, Wolfgang G. Zeier, Tristan W. Day, Martin Panthöfer, G. Jeffrey Snyder, and Wolfgang Tremel Journal of the American Chemical Society 2014 136 (34), 12035-12040
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:50079
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:29 Sep 2014 15:49
Last Modified:18 Nov 2016 17:17

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