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Enhanced adhesion from high energy ion irradiation

Werner, B. T. and Vreeland, T., Jr. and Mendenhall, M. H. and Qui, Y. and Tombrello, T. A. (1983) Enhanced adhesion from high energy ion irradiation. Thin Solid Films, 104 (1-2). pp. 163-166. ISSN 0040-6090. doi:10.1016/0040-6090(83)90557-6.

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We have found that irradiation of a variety of thin film-substrate combinations by heavy ion beams at energies of mega-electronvolts per atomic mass unit will produce a remarkable enhancement in the adherence of the film. For example, gold films can be firmly attached to soft materials such as Teflon using a 1 MeV beam of protons (10^(14) cm^(−2)) or helium ions (10^(13) cm^(−2)) and to harder materials such as silicon (10^(15) cm^(−2)), quartz (2 × 10^(15) cm^(−2)) and tungsten (2 × 10^(14) cm^(−2)) with 0.5 MeV a.m.u.^(−1) beams of fluorine or chlorine ions. In the case of metal films on semiconductors a low resistance contact results. The mixed layer at the interface is observed to be quite thin (approximately 50 Å or less); for silver on silicon electron diffraction and imaging studies of the interface region reveal the presence of crystalline silver compounds.

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Additional Information:© 1983 Elsevier Sequoia. Received October 15, 1982; accepted November 11, 1982. Available online 3 October 2002. Paper presented at the Symposium on Interfaces and Contacts, Boston, MA, U.S.A., November 2-4, 1982. This work was supported in part by the National Aeronautics and Space Administration (Contracts NAGW-202 and NAGW-148) and the National Science Foundation (Contract PHY79-23638).
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Band Aid Preprint Series in Atomic and Applied PhysicsBAP-36
Issue or Number:1-2
Record Number:CaltechAUTHORS:20141103-074121142
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Official Citation:B.T. Werner, T. Vreeland Jr., M.H. Mendenhall, Y. Qui, T.A. Tombrello, Enhanced adhesion from high energy ion irradiation, Thin Solid Films, Volume 104, Issues 1–2, 17 June 1983, Pages 163-166, ISSN 0040-6090, (
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:51149
Deposited By: Ruth Sustaita
Deposited On:03 Nov 2014 21:01
Last Modified:10 Nov 2021 19:06

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