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Electromagnetic power absorption due to bumps and trenches on flat surfaces

Pérez-Arancibia, Carlos and Zhang, Peng and Bruno, Oscar P. and Lau, Y. Y. (2014) Electromagnetic power absorption due to bumps and trenches on flat surfaces. Journal of Applied Physics, 116 (12). Art. No. 124904. ISSN 0021-8979. https://resolver.caltech.edu/CaltechAUTHORS:20141106-103044717

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Abstract

This paper presents a study of the absorption of electromagnetic power that results from the interaction of electromagnetic waves and cylindrical bumps or trenches on flat conducting surfaces. Configurations are characterized by means of adequately selected dimensionless variables and parameters so that applicability to mathematically equivalent (but physically diverse) systems can be achieved easily. Electromagnetic fields and absorption increments caused by such surface defects are evaluated by means of a high-order integral equation method which resolves fine details of the field near the surface, and which was validated by fully analytical approaches in a range of computationally challenging cases. The computational method is also applied to problems concerning bumps and trenches on imperfect conducting planes for which analytical solutions are not available. Typically, we find that absorption is enhanced by the presence of the defects considered, although, interestingly, absorption can also be significantly reduced in some cases—such as, e.g., in the case of a trench on a conducting plane where the incident electric field is perpendicular to the plane. Additionally, it is observed that, for some small-skin-depths large-wavelengths, the absorption increment is proportional to the increase in surface area. Significant physical insight is obtained on the heating that results from various types of electromagnetic incident fields.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1063/1.4896361 DOIArticle
http://scitation.aip.org/content/aip/journal/jap/116/12/10.1063/1.4896361PublisherArticle
Additional Information:© 2014 AIP Publishing LLC. Received 14 July 2014; accepted 12 September 2014; published online 26 September 2014. This Caltech-Michigan collaboration was stimulated by discussions with Dr. Arje Nachman and Dr. John Luginsland of the Air Force Office of Scientific Research. The Caltech group was supported by AFOSR and NSF under Contract Nos. FA9550-11-1-0193 and DMS-1008631, respectively. The University of Michigan group was supported by AFOSR grants FA9550-09-1-0662, FA9550-14-1-0309, and L-3 Communication Electron Devices Division.
Funders:
Funding AgencyGrant Number
Air Force Office of Scientific Research (AFOSR)FA9550-11-1-0193
NSFDMS-1008631
Air Force Office of Scientific Research (AFOSR)FA9550-09-1-0662
Air Force Office of Scientific Research (AFOSR)FA9550-14-1-0309
L-3 Communication Electron Devices DivisionUNSPECIFIED
Issue or Number:12
Record Number:CaltechAUTHORS:20141106-103044717
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20141106-103044717
Official Citation:Electromagnetic power absorption due to bumps and trenches on flat surfaces Pérez-Arancibia, Carlos and Zhang, Peng and Bruno, Oscar P. and Lau, Y. Y., Journal of Applied Physics, 116, 124904 (2014), DOI:http://dx.doi.org/10.1063/1.4896361
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:51363
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:06 Nov 2014 19:51
Last Modified:03 Oct 2019 07:32

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