Mohsen, Amr M. and McGill, T. C. and Mead, Carver A. (1973) Charge transfer in overlapping gate charge-coupled devices. IEEE Journal of Solid-State Circuits, 8 (3). pp. 191-207. ISSN 0018-9200. doi:10.1109/JSSC.1973.1050376. https://resolver.caltech.edu/CaltechAUTHORS:20150113-165257060
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Abstract
A detailed numerical simulation of the free charge transfer in overlapped gate charge-coupled devices is presented. The transport are analyzed in terms of thermal diffusion, self-induced fields, and fringing fields under all the relevant electrodes and interelectrode regions with time-varying gate potentials. The results of the charge transfer with different clocking schemes and clocking waveforms are presented. The dependence of the stages of the charge transfer on the device parameters are discussed in detail. A lumped-circuit model of CCD that could be used to obtain the charge-transfer characteristics with various clocking waveforms is also presented.
| Item Type: | Article | |||||||||
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| Additional Information: | © 1973 IEEE. Manuscript received August 15, 1972; revised January 10, 1973. This work was supported in part by the Office of Naval Research (A. Shostali) and the Naval Research Laboratory (D. F. Barbe). This paper was originally scheduled for publication in the April 1973 Special Issue of the IEEE JOURNAL OF SOLID-STATE CIRCUITS. | |||||||||
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| Issue or Number: | 3 | |||||||||
| DOI: | 10.1109/JSSC.1973.1050376 | |||||||||
| Record Number: | CaltechAUTHORS:20150113-165257060 | |||||||||
| Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20150113-165257060 | |||||||||
| Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
| ID Code: | 53664 | |||||||||
| Collection: | CaltechAUTHORS | |||||||||
| Deposited By: | INVALID USER | |||||||||
| Deposited On: | 14 Jan 2015 06:29 | |||||||||
| Last Modified: | 10 Nov 2021 20:05 |
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