Tong, W. and Ravichandran, G. and Christman, T. and Vreeland, T., Jr. (1994) Processing and properties of SiC-particulate reinforced titanium matrix composites by shock wave consolidation. Journal de Physique, 4 (C8). pp. 331-336. ISSN 0302-0738. https://resolver.caltech.edu/CaltechAUTHORS:20150126-141728441
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Abstract
Using shock wave consolidation, fully dense SiC-particulate reinforced Ti matrix composite compacts that are free from interfacial reactions and macroscopic cracks have been obtained. Proper post-consolidation annealing has been explored to improve impurity segregation and, thus, the ductility of the matrix. Various heat treatments of the composites produce controlled interfacial reaction zone sizes. Results of mechanical testing indicated that good ductility is retained in the Ti-SiC composites with a minimum interfacial reaction layer (<0.1 µm), while no interface reaction or an interfacial reaction layer of 0.25 µm thick or more is detrimental to the tensile ductility and strength of the composites.
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Additional Information: | © 1994 EDP Sciences. We would like to acknowledge the support of this research by the Division of Materials Research of the National Science Foundation through grant No. DMR-9116570, Program Director: Dr. B. MacDonald. We would like to thank Mr. Mohit Jain and Ms. Karina Mantilla for their help during the experiments and mechanical characterization of the compacts. | |||||||||
Group: | GALCIT | |||||||||
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Issue or Number: | C8 | |||||||||
Record Number: | CaltechAUTHORS:20150126-141728441 | |||||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20150126-141728441 | |||||||||
Official Citation: | Processing and properties of SiC-particulate reinforced titanium matrix composites by shock wave consolidation W. Tong, G. Ravichandran, T. Christman and T. Vreeland J. Phys. IV France 04 (C8) C8-331-C8-336 (1994) DOI: http://dx.doi.org/10.1051/jp4:1994850 | |||||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
ID Code: | 54089 | |||||||||
Collection: | CaltechAUTHORS | |||||||||
Deposited By: | Tony Diaz | |||||||||
Deposited On: | 26 Jan 2015 23:56 | |||||||||
Last Modified: | 09 Mar 2020 13:19 |
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