CaltechAUTHORS
  A Caltech Library Service

Particle Level Modeling of Dynamic Consolidation of Ti-SiC Powders

Benson, D. J. and Tong, W. and Ravichandran, G. (1995) Particle Level Modeling of Dynamic Consolidation of Ti-SiC Powders. Modelling and Simulation in Materials Science and Engineering, 3 (6). pp. 771-796. ISSN 0965-0393. doi:10.1088/0965-0393/3/6/003. https://resolver.caltech.edu/CaltechAUTHORS:20150226-101838767

Full text is not posted in this repository. Consult Related URLs below.

Use this Persistent URL to link to this item: https://resolver.caltech.edu/CaltechAUTHORS:20150226-101838767

Abstract

Shock wave processing of Ti-SiC powders has been numerically analyzed at the particle level using an Eulerian finite-element methodology. The analysis reveals that the shock consolidation is dominated by the viscoplastic deformation of Ti particles and that inertia plays a significant role in setting the magnitude of the shock rise time (i.e. the consolidation time). The addition of SiC particles is found to reduce slightly the degree of the localized deformation and the temperature rise around the Ti particle surfaces (the hot spots). The local temperature distribution and the thermal history of the hot spots from the simulation are found to be useful in estimating the initiation and growth of the interfacial reaction layer between Ti and SiC. The final particle packing configuration of Ti/SiC powder mixtures and the Ti-SiC reaction layer thickness predicted by the simulations are found to be consistent with experimental observations. Our study indicates that a combination of shock wave processing of powders by plate impact experiments with soft recovery capabilities and the accompanying numerical simulation of these experiments at the particle level holds promise for understanding thermal-mechanical mechanisms during shock consolidation of reactive powders.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1088/0965-0393/3/6/003 DOIArticle
http://iopscience.iop.org/0965-0393/3/6/003/PublisherArticle
ORCID:
AuthorORCID
Ravichandran, G.0000-0002-2912-0001
Additional Information:© 1995 IOP Publishing Ltd. Received 18 May 1995, accepted for publication 11 July 1995. DJB would like to thank the Army Research Office and the Los Alamos National Laboratory for their support of this research. WT and GR would like to acknowledge the support of this research by the Division of Materials Research of the National Science Foundation through grant No. DMR-9396132, program director Dr B MacDonald.
Group:GALCIT
Funders:
Funding AgencyGrant Number
Army Research Office (ARO)UNSPECIFIED
Los Alamos National Laboratory (LANL)UNSPECIFIED
NSFDMR-9396132
Issue or Number:6
Classification Code:PACS: 62.50.-p; 81.40.Lm; 62.20.F-
DOI:10.1088/0965-0393/3/6/003
Record Number:CaltechAUTHORS:20150226-101838767
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20150226-101838767
Official Citation:Particle-level modeling of dynamic consolidation of Ti-SiC powders D J Benson et al 1995 Modelling Simul. Mater. Sci. Eng. 3 771
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:55249
Collection:CaltechAUTHORS
Deposited By: Cheryl Gause
Deposited On:27 Feb 2015 01:14
Last Modified:10 Nov 2021 20:43

Repository Staff Only: item control page