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Interfacial reactions in Ni/CoSb_3 couples at 450 ºC

Chen, Wei-an and Chen, Sinn-wen and Tseng, Ssu-ming and Hsiao, Haw-wen and Chen, Yang-yuan and Snyder, G. Jeffrey and Tang, Yinglu (2015) Interfacial reactions in Ni/CoSb_3 couples at 450 ºC. Journal of Alloys and Compounds, 632 . pp. 500-504. ISSN 0925-8388.

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CoSb_3-based alloys are promising thermoelectric materials, and nickel is commonly used as barrier layer. This study examines interfacial reactions in the Ni/Sb and Ni/CoSb_3 couples reacted at 723 K. Three reaction phases, Ni_5Sb_2, NiSb and NiSb_2, are found in the Ni/Sb couples. In the Ni/CoSb_3 couples, the reaction path is Ni/Ni_5Sb_2/(Co,Ni)Sb/CoSb_3. Nickel is the fastest diffusion species, and the growth front is at the (Co,Ni)Sb/CoSb_3 interface. Co is the second fastest diffusion species, and a Co-rich region is formed at the Ni phase. The reaction layers grow with longer reaction time. Their average growth rates in the Ni/Sb and Ni/CoSb_3 couples reacted for 20 h are 1.1 μm/h and 1.0 μm/h, respectively.

Item Type:Article
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Snyder, G. Jeffrey0000-0003-1414-8682
Additional Information:© 2015 Elsevier B.V. Received 17 September 2014, Revised 23 December 2014, Accepted 4 January 2015, Available online 30 January 2015. The authors acknowledge the financial support of National Science Council of Taiwan (NSC102-3113-P-008-001).
Funding AgencyGrant Number
National Science Council (Taipei)NSC 101-3113-P-008-001
Subject Keywords:CoSb3; Ni; Interfacial reaction; Thermoelectric
Record Number:CaltechAUTHORS:20150413-142939539
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Official Citation:Wei-an Chen, Sinn-wen Chen, Ssu-ming Tseng, Haw-wen Hsiao, Yang-yuan Chen, G. Jeffrey Snyder, Yinglu Tang, Interfacial reactions in Ni/CoSb3 couples at 450°C, Journal of Alloys and Compounds, Volume 632, 25 May 2015, Pages 500-504, ISSN 0925-8388, (
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:56611
Deposited By: Ruth Sustaita
Deposited On:13 Apr 2015 22:03
Last Modified:03 Oct 2019 08:15

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