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Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants

Loh, Matthew and Emami-Neyestanak, Azita (2015) Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants. IEEE Journal of Solid-State Circuits, 50 (5). pp. 1275-1286. ISSN 0018-9200. doi:10.1109/JSSC.2015.2404335. https://resolver.caltech.edu/CaltechAUTHORS:20150602-152044505

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Abstract

Origami implant design is a 3D integration technique which addresses size and cost constraints in biomedical implants. This paper presents a capacitive proximity interconnect scheme that enables chip-to-chip communication across folds in the Origami implant, allowing increased flexibility of chip placement and orientation. The capacitive plate array senses link quality and chip-to-chip alignment, and adapts the data rate at each plate accordingly, shutting down poorly-coupled links to save power. Instead of using separate plate arrays for alignment sensing and communication, this interconnect embeds the alignment sensor and transceiver arrays within the same set of plates, so that link quality can be measured at the communications plates directly, thus simplifying their adaptation to alignment. In order to save power and area, the sensor circuitry is distributed across the array and shares functional blocks with the transceiver. Data rates from 10-60 Mbps are achieved over 4-12 μm of parylene-C, with efficiencies up to 0.180 pJ/bit.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/JSSC.2015.2404335DOIArticle
http://resolver.caltech.edu/CaltechAUTHORS:20190213-074612379Related ItemConference Paper
ORCID:
AuthorORCID
Emami-Neyestanak, Azita0000-0003-2608-9691
Additional Information:© 2015 IEEE. Manuscript received May 10, 2014; revised September 19, 2014, January 16, 2015, and January 24, 2015; accepted February 03, 2015. Date of publication March 12, 2015; date of current version April 30, 2015. This paper was approved by Associate Editor Michiel Pertijs. This work was supported by the National Science Foundation and STMicroelectronics.
Funders:
Funding AgencyGrant Number
NSFUNSPECIFIED
STMicroelectronicsUNSPECIFIED
Subject Keywords:Adaptive, alignment sensor, biomedical implants, Origami, parylene, proximity communication, 3D integration
Issue or Number:5
DOI:10.1109/JSSC.2015.2404335
Record Number:CaltechAUTHORS:20150602-152044505
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20150602-152044505
Official Citation:Loh, M.; Emami-Neyestanak, A., "Capacitive Proximity Communication With Distributed Alignment Sensing for Origami Biomedical Implants," Solid-State Circuits, IEEE Journal of , vol.50, no.5, pp.1275,1286, May 2015 doi: 10.1109/JSSC.2015.2404335
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:57949
Collection:CaltechAUTHORS
Deposited By:INVALID USER
Deposited On:02 Jun 2015 23:52
Last Modified:10 Nov 2021 21:57

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