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Thermal conductance measurements of bolted copper joints for SuperCDMS

Schmitt, R. L. and Tatkowski, G. and Ruschman, M. and Golwala, S. R. and Kellaris, N. and Daal, M. and Hall, J. and Hoppe, E. W. (2015) Thermal conductance measurements of bolted copper joints for SuperCDMS. Cryogenics, 70 . pp. 41-46. ISSN 0011-2275. https://resolver.caltech.edu/CaltechAUTHORS:20150820-094605136

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Abstract

Joint thermal conductance testing has been undertaken for bolted copper to copper connections from 60 mK to 26 K. This testing was performed to validate an initial design basis for the SuperCDMS experiment, where a dilution refrigerator will be coupled to a cryostat via multiple bolted connections. Copper used during testing was either gold plated or passivated with citric acid to prevent surface oxidation. Results obtained are well fit by a power law regression of joint thermal conductance to temperature and match well with data collected during a literature review.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1016/j.cryogenics.2015.04.006DOIArticle
http://www.sciencedirect.com/science/article/pii/S0011227515000545PublisherArticle
ORCID:
AuthorORCID
Golwala, S. R.0000-0002-1098-7174
Daal, M.0000-0002-1134-2116
Additional Information:© 2015 Elsevier B.V. Received 14 January 2015; Received in revised form 13 April 2015; Accepted 21 April 2015; Available online 28 April 2015. Fermi National Accelerator Laboratory is operated by Fermi Research Alliance, LLC under Contract No. De-AC02-07CH11359 with the United States Department of Energy. Fermilab report number: FERMILAB-PUB-14-522-PPD.
Funders:
Funding AgencyGrant Number
Department of Energy (DOE)DE-AC02-07CH11359
Subject Keywords:Joint conductance; Contact; Bolt; Copper; Boundary resistance
Other Numbering System:
Other Numbering System NameOther Numbering System ID
FermilabFERMILAB-PUB-14-522-PPD
Record Number:CaltechAUTHORS:20150820-094605136
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20150820-094605136
Official Citation:Schmitt, R. L., Tatkowski, G., Ruschman, M., Golwala, S., Kellaris, N., Daal, M., . . . Hoppe, E. W. (2015). Thermal conductance measurements of bolted copper joints for SuperCDMS. Cryogenics, 70, 41-46. doi: http://dx.doi.org/10.1016/j.cryogenics.2015.04.006
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:59785
Collection:CaltechAUTHORS
Deposited By: Jason Perez
Deposited On:20 Aug 2015 23:19
Last Modified:09 Mar 2020 13:18

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