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Aerosol silicon nanoparticles for use in semiconductor device fabrication

Flagan, Richard C. and Boer, Elizabeth A. and Ostraat, Michele L. and Atwater, Harry A. and Bell, Lloyd D. II (2003) Aerosol silicon nanoparticles for use in semiconductor device fabrication. Patent number: US6586785B2. https://resolver.caltech.edu/CaltechAUTHORS:20150909-170253333

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Abstract

A stratum or discontinuous monolayer of dielectric-coated semiconductor particles includes a high density of semiconductor nanoparticles with a tightly controlled range of particle sizes in the nanometer range. In an exemplary embodiment, the nanoparticles of the stratum are substantially the same size and include cores which are crystalline, preferably single crystalline, and include a density which is approximately the same as the bulk density of the semiconductor material of which the particle cores are formed. In an exemplary embodiment, the cores and particles are preferably spherical in shape. The stratum is characterized by a uniform particle density on the order of 10.sup.12 to 10.sup.13 particles/cm.sup.2. A plurality of adjacent particles contact each other, but the dielectric shells provide electrical isolation and prevent lateral conduction between the particles of the stratum. The stratum includes a density of foreign atom contamination of less than 10.sup.11 atoms/cm.sup.2. The stratum is advantageously used as the floating gate in a non-volatile memory device such as a MOSFET. The non-volatile memory device including the discontinuous floating gate of semiconductor nanoparticles exhibits excellent endurance behavior and long-term non-volatility.


Item Type:Patent
Related Patents:US6723606B2, WO2002003472A3, WO2002003430A2, WO2002003472A2, US20020074565A1, US20020098653A1
Patent Classification:Current U.S. Class: 257/261; 257/314; 257/321; 257/407; 257/412; 257/741; 257/77; 438/503; 438/507; 438/509. Current CPC Class: B82Y 10/00 (20130101); H01L 29/66833 (20130101); H01L 21/28282 (20130101); H01L 29/42332 (20130101); H01L 21/28273 (20130101); G11C 2216/06 (20130101). Current International Class: H01L 29/66 (20060101); H01L 29/80 (20060101); H01L 31/0336 (20060101); H01L 31/0264 (20060101); H01L 029/80 ()
Patent Assignee:California Institue of Technology
Related URLs:
URLURL TypeDescription
https://patents.google.com/patent/US6586785B2/enPatentGoogle Patents site
http://patft.uspto.gov/netacgi/nph-Parser?Sect2=PTO1&Sect2=HITOFF&p=1&u=/netahtml/PTO/search-bool.html&r=1&f=G&l=50&d=PALL&RefSrch=yes&Query=PN/6586785PatentU.S. Patent Office
ORCID:
AuthorORCID
Flagan, Richard C.0000-0001-5690-770X
Atwater, Harry A.0000-0001-9435-0201
Additional Information:Publication number US6586785B2. Publication type Grant. Publication date July 1, 2003. Application number US 09/895,790. Filing date June 29, 2001. Priority date June 29, 2000. Government Interests: STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT. The U.S. Government has certain rights in this invention pursuant to grant DMR-9871850 awarded by the National Science Foundation. Parent Case Text: RELATED APPLICATIONS. This application claims priority of U.S. provisional application serial No. 60/215,390, entitled AEROSOL PROCESS FOR FABRICATING DISCONTINUOUS FLOATING GATE MICROELECTRONIC DEVICES, filed on Jun. 29, 2000, and U.S. provisional application serial No. 60/215,400, entitled DISCONTINUOUS FLOATING GATE INCORPORATING AEROSOL NANOPARTICLES, filed on Jun. 29, 2000. Parent Case Text: RELATED APPLICATIONS. This application is related to U.S. application Ser. No. 06/215,390, entitled AEROSOL PROCESS FOR FABRICATING DISCONTINUOUS FLOATING GATE MICROELECTRONIC DEVICES, filed on Jun. 29, 2001.
Funders:
Funding AgencyGrant Number
NSFDMR-9871850
Record Number:CaltechAUTHORS:20150909-170253333
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20150909-170253333
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:60157
Collection:CaltechAUTHORS
Deposited By: Irina Meininger
Deposited On:19 Feb 2016 23:09
Last Modified:03 Oct 2019 08:54

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