Saeedi, Saman and Menezo, Sylvie and Pares, Gabriel and Emami, Azita (2016) A 25 Gb/s 3D-Integrated CMOS/Silicon-Photonic Receiver for Low-Power High-Sensitivity Optical Communication. Journal of Lightwave Technology, 34 (12). pp. 2924-2933. ISSN 0733-8724. http://resolver.caltech.edu/CaltechAUTHORS:20160622-132148230
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Abstract
Integrating optical receivers based on double-sampling architecture exhibit a low-power alternative to those designed around transimpedance amplifiers (TIA). In this paper, we present a 3D-integrated CMOS/silicon-photonic optical receiver. The receiver features a low-bandwidth TIA integrating front-end double-sampling technique and dynamic offset modulation. The copper-pillar-based 3D-integration technology used here enables ultralow parasitics and 40 μm pitch for interconnection. We study different tradeoffs in designing an optical receiver and how to choose between a full-bandwidth TIA front-end and integrating architecture using a resistive front-end or a low-bandwidth TIA front-end. The design methodology is supported by measurements of two 3D-integrated prototypes based on a conventional TIA and a double-sampling integrating receiver. The proposed receiver architecture achieves −14.9 dBm of sensitivity and energy efficiency of 170 fJ/b at 25 Gb/s, while the conventional receiver achieves a sensitivity of −10.4 dBm and energy efficiency of 260 fJ/b at 21.2 Gb/s.
| Item Type: | Article | |||||||||
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| Additional Information: | © 2015 IEEE. Manuscript received July 22, 2015; revised September 25, 2015; accepted October 15, 2015. Date of publication October 25, 2015; date of current version June 1, 2016. The authors would like to thank ST Microelectronics for chip fabrication. | |||||||||
| Subject Keywords: | energy efficiency, optical receivers, sensitivity, silicon photonics, 3D-integration | |||||||||
| Record Number: | CaltechAUTHORS:20160622-132148230 | |||||||||
| Persistent URL: | http://resolver.caltech.edu/CaltechAUTHORS:20160622-132148230 | |||||||||
| Official Citation: | S. Saeedi, S. Menezo, G. Pares and A. Emami, "A 25 Gb/s 3D-Integrated CMOS/Silicon-Photonic Receiver for Low-Power High-Sensitivity Optical Communication," in Journal of Lightwave Technology, vol. 34, no. 12, pp. 2924-2933, June15, 15 2016. doi: 10.1109/JLT.2015.2494060 | |||||||||
| Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
| ID Code: | 68595 | |||||||||
| Collection: | CaltechAUTHORS | |||||||||
| Deposited By: | Tony Diaz | |||||||||
| Deposited On: | 23 Jun 2016 00:20 | |||||||||
| Last Modified: | 23 Jun 2016 00:20 |
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