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Parylene-on-oil packaging for implantable pressure sensors

Shapero, Aubrey and Liu, Yang and Tai, Yu-Chong (2016) Parylene-on-oil packaging for implantable pressure sensors. In: 29th International Conference on Micro Electro Mechanical Systems (MEMS), 2016. IEEE , Piscataway, NJ, pp. 403-406. ISBN 978-1-5090-1973-1. http://resolver.caltech.edu/CaltechAUTHORS:20161013-101957404

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Abstract

This paper reports the feasibility study of a parylene-on-oil encapsulation packaging method of pressure sensors targeted for long-term implantation. Commercial barometric digital-output pressure sensors are enclosed in silicone oil and then encapsulated in situ with parylene-C or -D (PA-C, PA-D). Experimentally, sensors encapsulated with 30,000cSt silicone oil and 24.92??m PA-D show good performance for 6 weeks in 77??C saline with >99% of original sensitivity, corresponding to a predicted lifetime of around 21 months in 37??C saline according to the Arrhenius equation with an activation energy of ???0.6eV [1]. This work shows that, with proper designs, such a packaging method can preserve the original pressure sensor sensitivity without offset, validated throughout accelerated lifetime tests. A model to predict sensitivity retention after packaging is also presented.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1109/MEMSYS.2016.7421646DOIArticle
http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=7421646PublisherArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2016 IEEE. Date Added to IEEE Xplore: 29 February 2016. The authors would like to thank Mr. Trevor Roper for his help on all the equipment at the Caltech MEMS Lab.
Subject Keywords:Decision support systems, Micromechanical devices
Record Number:CaltechAUTHORS:20161013-101957404
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20161013-101957404
Official Citation:A. Shapero, Y. Liu and Y. C. Tai, "Parylene-on-oil packaging for implantable pressure sensors," 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS), Shanghai, 2016, pp. 403-406. doi: 10.1109/MEMSYS.2016.7421646
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:71043
Collection:CaltechAUTHORS
Deposited By: Ruth Sustaita
Deposited On:13 Oct 2016 17:34
Last Modified:13 Oct 2016 17:34

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