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Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition

Johnson, M. T. and Keck, C. H. C. and Faber, K. T. (2016) Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition. Journal of the Electrochemical Society, 164 (2). D48-D52. ISSN 0013-4651. http://resolver.caltech.edu/CaltechAUTHORS:20170227-085745824

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Abstract

A multi-element, time-dependent model developed by Childers et al. [A.S. Childers, M.T. Johnson, J. Ramírez-Rico, and K.T. Faber, J. Electrochem. Soc., 160:3093-3102, 2013] for copper infiltration of large (∼50–200 µm diameter), high aspect ratio (∼60) through-hole channels was experimentally tested for validity. The model built on the work of Akolkar and Landau [R. Akolkar and U. Landau, J. Electrochem. Soc., 151:702-711, 2004] for copper deposition in micro-scale integrated circuitry. Childers’ model broadens the original by including the transport and adsorption of all electrolyte species - inhibitors, accelerators, and copper ions. The resulting model is tested experimentally with wood-derived biomorphic carbon materials. Results indicate that model predictions of premature pore choke off are in agreement with quantitative observations of copper infiltration and qualitative imaging of plated pore profiles. Low accelerator concentrations (0.002 ppm) yielded the highest quantity of copper infiltration without premature closure.


Item Type:Article
Related URLs:
URLURL TypeDescription
http://dx.doi.org/10.1149/2.0391702jesDOIArticle
http://jes.ecsdl.org/content/164/2/D48PublisherArticle
ORCID:
AuthorORCID
Faber, K. T.0000-0001-6585-2536
Additional Information:© 2016 The Electrochemical Society. Manuscript submitted October 10, 2016; revised manuscript received November 28, 2016. Published December 13, 2016. C.H.C.K. worked under the auspices of the Science Research Program at Choate Rosemary Hall. K.T.F.’s work was supported by the National Science Foundation under DMR-1411218.
Funders:
Funding AgencyGrant Number
NSFDMR-1411218
Subject Keywords:Additive assisted; Copper electrodeposition; Experimental validation
Record Number:CaltechAUTHORS:20170227-085745824
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20170227-085745824
Official Citation:M. T. Johnson, C. H. C. Keck, and K. T. Faber Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition J. Electrochem. Soc. 2017 164(2): D48-D52; doi:10.1149/2.0391702jes
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:74540
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:27 Feb 2017 18:10
Last Modified:27 Feb 2017 18:10

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