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Creep of parylene-C film

Lin, Jeffrey Chun-Hui and Deng, Peigang and Lam, Gilbert and Lu, Bo and Lee, Yi-Kuen and Tai, Yu-Chong (2011) Creep of parylene-C film. In: 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE , Piscataway, NJ, pp. 2698-2701. ISBN 978-1-4577-0156-6 . https://resolver.caltech.edu/CaltechAUTHORS:20170227-172935891

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Abstract

The glass transition temperature of as-deposited parylene-C is first measured to be 50°C with a ramping-temperature-dependent modulus experiment. The creep behavior of parylene-C film in the primary and secondary creep region is then investigated below and above this glass transition temperature using a dynamic mechanical analysis (DMA) machine Q800 from TA instruments at 8 different temperatures: 10, 25, 40, 60, 80, 100, 120 and 150°C. The Burger's model, which is the combined Maxwell model and Kelvin-Voigt model, fits well with our primary and secondary creep data. Accordingly, the results show that there's little or no creep below the glass transition temperature. Above the glass transition temperature, the primary creep and creep rate increases with the temperature, with a retardation time constant around 6 minutes.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/TRANSDUCERS.2011.5969483DOIArticle
http://ieeexplore.ieee.org/document/5969483/PublisherArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2011 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES) and partially supported by KAUST Award No. SA-C0040/UK-C0016. The authors would like to thank Trevor Roper’s help in terms of sample preparation, machines’ maintenance, and instrument’s installation.
Funders:
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
King Abdullah University of Science and Technology (KAUST)SA-C0040/UK-C0016
Subject Keywords:Creep, viscoelasticity, parylene-C, glass transition temperature
Record Number:CaltechAUTHORS:20170227-172935891
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20170227-172935891
Official Citation:J. C. H. Lin, P. Deng, G. Lam, B. Lu, Y. K. Lee and Y. C. Tai, "Creep of parylene-C film," 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Beijing, 2011, pp. 2698-2701. doi: 10.1109/TRANSDUCERS.2011.5969483
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:74570
Collection:CaltechAUTHORS
Deposited By: Kristin Buxton
Deposited On:28 Feb 2017 05:05
Last Modified:03 Oct 2019 16:40

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