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Adhesion-enhancing surface treatments for parylene deposition

Chang, Jay Han-Chieh and Lu, Bo and Tai, Yu-Chong (2011) Adhesion-enhancing surface treatments for parylene deposition. In: 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE , Piscataway, NJ, pp. 390-393. ISBN 978-1-4577-0156-6. https://resolver.caltech.edu/CaltechAUTHORS:20170227-174103451

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Abstract

Parylene-C has been extensively used in biomedical devices as a conformal and biocompatible coating. It is also a good material for implantation. Unfortunately, serious delamination between parylene-C and other materials is often found even during standard MEMS processes such as lift-off and sacrificial photoresist releasing. Therefore, surface treatments before parylene deposition that can enhance the interface adhesion between the deposited parylene and the coated surface are highly desirable. Interestingly, the chemical structure of Parylene-C does suggest that parylene-C deposition on a clean hydrophobic surface favors a good interface adhesion. This work is then to study various surface treatments, especially on silicon and another parylene-C surfaces, by hexane, toluene, propylene carbonate (P.C.), and tetrafluoromethane (CF4) plasma. Our hypothesis is then good surface cleaning can lead to interface adhesion. We report the results here using parameters such as peeling force, soaking undercut rate, and vertical attack bubble density (VABD) to quantify the effectiveness of these adhesion treatments.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/TRANSDUCERS.2011.5969484DOIArticle
http://ieeexplore.ieee.org/document/5969484/PublisherArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2011 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.
Funders:
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
Subject Keywords:Parylene-C, Adhesion, Peeling Test
Record Number:CaltechAUTHORS:20170227-174103451
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20170227-174103451
Official Citation:J. H. C. Chang, B. Lu and Y. C. Tai, "Adhesion-enhancing surface treatments for parylene deposition," 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Beijing, 2011, pp. 390-393. doi: 10.1109/TRANSDUCERS.2011.5969484
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:74571
Collection:CaltechAUTHORS
Deposited By: Kristin Buxton
Deposited On:28 Feb 2017 05:03
Last Modified:03 Oct 2019 16:40

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