Chang, Jay Han-Chieh and Huang, Ray and Tai, Yu-Chong (2011) High density 256-channel chip integration with flexible parylene pocket. In: 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE , Piscataway, NJ, pp. 378-381. ISBN 978-1-4577-0156-6. https://resolver.caltech.edu/CaltechAUTHORS:20170228-163251176
Full text is not posted in this repository. Consult Related URLs below.
Use this Persistent URL to link to this item: https://resolver.caltech.edu/CaltechAUTHORS:20170228-163251176
Abstract
Current state-of-the-art technologies for retinal prosthetics suffer greatly from complicated IC packaging with high lead count because there is the lack of high density and high lead-count connection. To overcome this challenge, we develop here a packaging technique that utilizes a flexible parylene pocket with metal pads to house a chip for aligned connection. This reported pocket can be designed with the right size to house any IC chip and/or a discrete component. As a demonstration, a 256-channel conduction chip along with an RFID chip have been connected and tested with this technique. The results show that this new technique can be further improved to achieve 10,000 connections within an area of 1 cm^2.
Item Type: | Book Section | |||||||||
---|---|---|---|---|---|---|---|---|---|---|
Related URLs: |
| |||||||||
ORCID: |
| |||||||||
Additional Information: | © 2011 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 256 channel retinal chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication. | |||||||||
Funders: |
| |||||||||
Subject Keywords: | Retinal prosthetic, Parylene pocket | |||||||||
Record Number: | CaltechAUTHORS:20170228-163251176 | |||||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20170228-163251176 | |||||||||
Official Citation: | J. H. C. Chang, R. Huang and Y. C. Tai, "High density 256-channel chip integration with flexible parylene pocket," 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Beijing, 2011, pp. 378-381. doi: 10.1109/TRANSDUCERS.2011.5969478 | |||||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
ID Code: | 74614 | |||||||||
Collection: | CaltechAUTHORS | |||||||||
Deposited By: | Kristin Buxton | |||||||||
Deposited On: | 01 Mar 2017 00:44 | |||||||||
Last Modified: | 03 Oct 2019 16:40 |
Repository Staff Only: item control page