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High density 256-channel chip integration with flexible parylene pocket

Chang, Jay Han-Chieh and Huang, Ray and Tai, Yu-Chong (2011) High density 256-channel chip integration with flexible parylene pocket. In: 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE , Piscataway, NJ, pp. 378-381. ISBN 978-1-4577-0156-6. https://resolver.caltech.edu/CaltechAUTHORS:20170228-163251176

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Abstract

Current state-of-the-art technologies for retinal prosthetics suffer greatly from complicated IC packaging with high lead count because there is the lack of high density and high lead-count connection. To overcome this challenge, we develop here a packaging technique that utilizes a flexible parylene pocket with metal pads to house a chip for aligned connection. This reported pocket can be designed with the right size to house any IC chip and/or a discrete component. As a demonstration, a 256-channel conduction chip along with an RFID chip have been connected and tested with this technique. The results show that this new technique can be further improved to achieve 10,000 connections within an area of 1 cm^2.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/TRANSDUCERS.2011.5969478DOIArticle
http://ieeexplore.ieee.org/document/5969478/PublisherArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2011 IEEE. This work is supported by Biomimetic MicroElectronic Systems (BMES). The authors would also like to thank Dr. Wentai Liu from UCSC for providing 256 channel retinal chips and Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.
Funders:
Funding AgencyGrant Number
Biomimetic MicroElectronic Systems (BMES)UNSPECIFIED
Subject Keywords:Retinal prosthetic, Parylene pocket
Record Number:CaltechAUTHORS:20170228-163251176
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20170228-163251176
Official Citation:J. H. C. Chang, R. Huang and Y. C. Tai, "High density 256-channel chip integration with flexible parylene pocket," 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, Beijing, 2011, pp. 378-381. doi: 10.1109/TRANSDUCERS.2011.5969478
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:74614
Collection:CaltechAUTHORS
Deposited By: Kristin Buxton
Deposited On:01 Mar 2017 00:44
Last Modified:03 Oct 2019 16:40

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