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An optical fiber-taper probe for wafer-scale microphotonic device characterization

Michael, C. P. and Borselli, M and Johnson, T. J. and Chrystal, C. and Painter, O. (2007) An optical fiber-taper probe for wafer-scale microphotonic device characterization. Optics Express, 15 (8). pp. 4745-4752. ISSN 1094-4087.

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A small depression is created in a straight optical fiber taper to form a local probe suitable for studying closely spaced, planar microphotonic devices. The tension of the “dimpled” taper controls the probe-sample interaction length and the level of noise present during coupling measurements. Practical demonstrations with high-Q silicon microcavities include testing a dense array of undercut microdisks (maximum Q = 3.3×10^6) and a planar microring (Q = 4.8×10^6).

Item Type:Article
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Painter, O.0000-0002-1581-9209
Additional Information:© 2007 Optical Society of America Received 9 Feb 2007; revised 15 Mar 2007; accepted 19 Mar 2007; published 4 Apr 2007 We thank M. D. Henry, K. Srinivasan, and K. Hennessy for fabrication assistance and M. Hochberg and A. Scherer for the SOI wafer used to fabricate the planar microring sample. This work was supported by the DARPA EPIC program, contract number HR0011-04-1-0054. For graduate fellowship support, we thank the Moore Foundation (CPM and MB), NSF (CPM), NPSC (MB), and HRL Laboratories (MB).
Funding AgencyGrant Number
Defense Advanced Research Projects Agency (DARPA)HR0011-04-1-0054
Gordon and Betty Moore FoundationUNSPECIFIED
National Physical Science ConsortiumUNSPECIFIED
Hughes Research LaboratoriesUNSPECIFIED
Issue or Number:8
Record Number:CaltechAUTHORS:MICoe07
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Official Citation:C. P. Michael, M. Borselli, T. J. Johnson, C. Chrystal, and O. Painter, "An optical fiber-taper probe for wafer-scale microphotonic device characterization," Opt. Express 15, 4745-4752 (2007)
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:8160
Deposited By: Archive Administrator
Deposited On:31 Jul 2007
Last Modified:02 Oct 2019 23:48

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