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Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials

Lifson, Max L. and Kim, Min-Woo and Greer, Julia R. and Kim, Bong-Joong (2017) Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials. Nano Letters, 17 (12). pp. 7737-7743. ISSN 1530-6984. http://resolver.caltech.edu/CaltechAUTHORS:20171107-134955226

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Abstract

Low dielectric constant (low-k) materials have gained increasing popularity because of their critical role in developing faster, smaller, and higher performance devices. Their practical use has been limited by the strong coupling among mechanical, thermal, and electrical properties of materials and their dielectric constant; a low-k is usually attained by materials that are very porous, which results in high compliance, that is, silica aerogels; high dielectric loss, that is, porous polycrystalline alumina; and poor thermal stability, that is, Sr-based metal–organic frameworks. We report the fabrication of 3D nanoarchitected hollow-beam alumina dielectrics which k is 1.06–1.10 at 1 MHz that is stable over the voltage range of −20 to 20 V and a frequency range of 100 kHz to 10 MHz. This dielectric material can be used in capacitors and is mechanically resilient, with a Young’s modulus of 30 MPa, a yield strength of 1.07 MPa, a nearly full shape recoverability to its original size after >50% compressions, and outstanding thermal stability with a thermal coefficient of dielectric constant (TCK) of 2.43 × 10^(-5) K^(-1) up to 800 °C. These results suggest that nanoarchitected materials may serve as viable candidates for ultra low-k materials that are simultaneously mechanically resilient and thermally and electrically stable for microelectronics and devices.


Item Type:Article
Related URLs:
URLURL TypeDescription
https://doi.org/10.1021/acs.nanolett.7b03941DOIArticle
http://pubs.acs.org/doi/10.1021/acs.nanolett.7b03941PublisherArticle
http://pubs.acs.org/doi/suppl/10.1021/acs.nanolett.7b03941PublisherSupporting Information
ORCID:
AuthorORCID
Lifson, Max L.0000-0002-0382-182X
Greer, Julia R.0000-0002-9675-1508
Additional Information:© 2017 American Chemical Society. Received: September 13, 2017; Revised: October 28, 2017; Published: November 7, 2017. B.-J.K. and J.R.G. acknowledge financial support from the “GIST-Caltech Research Collaboration” grant funded by the GIST in 2017. The authors would like to thank L. R. Meza, O. A. Tertuliano, A. Maggi, C. M. Portela, and X. Xia for their helpful discussions and fabrication assistance. Portions of this work were conducted in the Lewis lab at Caltech. The authors declare no competing financial interest.
Funders:
Funding AgencyGrant Number
GIST-Caltech Research CollaborationUNSPECIFIED
Subject Keywords:dielectric constant, low-k, nanolattice, porosity, Young's modulus
Record Number:CaltechAUTHORS:20171107-134955226
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20171107-134955226
Official Citation:Enabling Simultaneous Extreme Ultra Low-k in Stiff, Resilient, and Thermally Stable Nano-Architected Materials. Max L. Lifson, Min-Woo Kim, Julia R. Greer, and Bong-Joong Kim. Nano Letters 2017 17 (12), 7737-7743. DOI: 10.1021/acs.nanolett.7b03941
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:83037
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:07 Nov 2017 22:04
Last Modified:11 Jan 2018 18:40

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