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Determination of thin-film debonding parameters from telephone-cord measurements

Gioia, G. and Ortiz, M. (1998) Determination of thin-film debonding parameters from telephone-cord measurements. Acta Materialia, 46 (1). pp. 169-175. ISSN 1359-6454. doi:10.1016/S1359-6454(97)00211-5.

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Methods are put forward for the determination of the fracture energy and kinetic coefficient of thin film/substrate interfaces from measurements performed on telephone cord blisters. This work is based on a previously proposed model for the characterization of debonding features in compressed thin films. The advantages of the proposed methods stem from the following facts concerning telephone cord blisters: (i) they are spontaneous debonding features, and therefore more amenable than artificially contrived features to yield realistic debonding parameters; (ii) they are very commonly observed in compressed thin films; (iii) as revealed by our model, their boundaries are characterized by a constant fracture mode mixity, and (iv) the driving force for debonding equals the fracture energy everywhere on their boundaries.

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Ortiz, M.0000-0001-5877-4824
Additional Information:© 1997 Elsevier. Received 26 February 1997, Accepted 26 June 1997, Available online 26 January 1999.
Issue or Number:1
Record Number:CaltechAUTHORS:20171213-100854187
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Official Citation:G. Gioia, M. Ortiz, Determination of thin-film debonding parameters from telephone-cord measurements, In Acta Materialia, Volume 46, Issue 1, 1998, Pages 169-175, ISSN 1359-6454, (
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:83875
Deposited By: Lydia Suarez
Deposited On:13 Dec 2017 18:14
Last Modified:15 Nov 2021 20:14

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