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Mechanical characterization of solution-derived nanoparticle silver ink thin films

Greer, Julia R. and Street, Robert A. (2007) Mechanical characterization of solution-derived nanoparticle silver ink thin films. Journal of Applied Physics, 101 (10). Art. No. 103529. ISSN 0021-8979. doi:10.1063/1.2735404. https://resolver.caltech.edu/CaltechAUTHORS:GREjap07

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Abstract

Mechanical properties of sintered silver nanoparticles are investigated via substrate curvature and nanoindentation methods. Substrate curvature measurements reveal that permanent microstructural changes occur during initial heating while subsequent annealing results in nearly elastic behavior of the thinner films. Thicker films were found to crack upon thermal treatment. The coefficient of thermal expansion was determined from linear slopes of curvature curves to be 1.9±0.097 ppm/°C, with elastic modulus and hardness determined via nanoindentation. Accounting for substrate effects, nanoindentation hardness and modulus remained constant for different film thicknesses and did not appear to be a function of annealing conditions. Hardness of 0.91 GPa and modulus of 110 GPa are somewhat lower than expected for a continuous nanocrystalline silver film, most likely due to porosity.


Item Type:Article
Related URLs:
URLURL TypeDescription
https://doi.org/10.1063/1.2735404DOIUNSPECIFIED
ORCID:
AuthorORCID
Greer, Julia R.0000-0002-9675-1508
Street, Robert A.0000-0001-6279-0552
Additional Information:©2007 American Institute of Physics (Received 22 January 2007; accepted 23 March 2007; published online 29 May 2007) The authors gratefully acknowledge Fred Endicott for SEM support and Cabot Corporation for providing the inks.
Subject Keywords:silver; nanoparticles; metallic thin films; ink; indentation; annealing; elasticity; thermal expansion; elastic moduli; hardness
Issue or Number:10
DOI:10.1063/1.2735404
Record Number:CaltechAUTHORS:GREjap07
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:GREjap07
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:8445
Collection:CaltechAUTHORS
Deposited By: Archive Administrator
Deposited On:13 Aug 2007
Last Modified:08 Nov 2021 20:50

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