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Parylene-oil-encapsulated low-drift implantable pressure sensors

Shapero, Aubrey and Tai, Yu-Chong (2018) Parylene-oil-encapsulated low-drift implantable pressure sensors. In: 2018 IEEE Micro Electro Mechanical Systems (MEMS). IEEE , Piscataway, NJ, pp. 47-50. ISBN 978-1-5386-4782-0.

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This paper demonstrates a parylene-oil-encapsulated packaging technology that applies to commercial pressure sensors to enable intraocular pressure sensing with minimal drift. Commercial digital-output barometers are chosen to be packaged first with 100,000 cSt silicone oil and then sub-micron thick parylene within the volume of the original housing. It is newly found that parylene type and oil viscosity can decide the sign and magnitude of the intrinsic stress in parylene. Additionally, the effect of deposited thickness and temperature on film stress is studied through induced pressure offset. When properly designed, parylene-oil-encapsulated pressure sensors maintain <0.3% sensitivity drift and <1 to 2 mmHg offset drift for over 50 to 106+ days in 77 °C saline, equivalent to 25 to 53+ months at 37 °C [1]. This new compact packaging method is promising for converting air-operated commercial sensors to be “implantable” with nearly original sensitivity and minimal offset and drift.

Item Type:Book Section
Related URLs:
URLURL TypeDescription
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2018 IEEE. The authors thank Trevor Roper for maintaining the Caltech Micromachining Laboratory and Cameron Sylber for help with longevity measurements. This work was supported by the Rosen Bioengineering Center.
Funding AgencyGrant Number
Benjamin M. Rosen Bioengineering CenterUNSPECIFIED
Subject Keywords:Packaging, Parylene, Implantable pressure sensor, Lifetime, Reliability, Low-drift
Record Number:CaltechAUTHORS:20180503-102302894
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Official Citation:A. Shapero and Y. C. Tai, "Parylene-oil-encapsulated low-drift implantable pressure sensors," 2018 IEEE Micro Electro Mechanical Systems (MEMS), Belfast, United Kingdom, 2018, pp. 47-50. doi: 10.1109/MEMSYS.2018.8346478. URL:
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:86206
Deposited By: Tony Diaz
Deposited On:03 May 2018 21:03
Last Modified:15 Nov 2021 20:36

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