CaltechAUTHORS
  A Caltech Library Service

Mechanical properties of thin polysilicon films by means of probe microscopy

Chasiotis, Ioannis and Knauss, Wolfgang G. (1998) Mechanical properties of thin polysilicon films by means of probe microscopy. In: Materials and Device Characterization in Micromachining. Proceedings of SPIE. No.3512. Society of Photo-optical Instrumentation Engineers (SPIE) , Bellingham, WA, pp. 66-75. ISBN 9780819429711. http://resolver.caltech.edu/CaltechAUTHORS:20180813-091037460

[img] PDF - Published Version
See Usage Policy.

4076Kb

Use this Persistent URL to link to this item: http://resolver.caltech.edu/CaltechAUTHORS:20180813-091037460

Abstract

A new method for tensile testing of thin films is being developed. An electrostatic grip apparatus was designed and implemented to measure the elastic and ultimate tensile properties (Young's modulus, Poisson's ratio and tensile strength) of surface micromachined polysilicon specimens. The tensile specimens are 'dog-bone' shaped ending in a large 'paddle' for electrostatic gripping. The test section of the specimens is 400 micrometers long and with 2 micrometer X 50 micrometer cross section. The method employs Atomic Force Microscope (AFM) or Scanning Tunneling Microscope (STM) acquired surface topologies of deforming specimens to determine (fields of) strains. By way of the method of Digital Image Correlation (DIC), the natural surface roughness features are used as distributed markers. The effect of markers artificially deposited on the surface is examined computationally. Also the significance of other parameters on property measurements, such as surface roughness, has been examined computationally. Initial results obtained using the tensile test apparatus are presented.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1117/12.324072DOIArticle
Additional Information:© 1998 Society of Photo-Optical Instrumentation Engineers (SPIE). The authors would like to acknowledge Dr. Y. C. Tai of Electrical Engineering Department at Caltech and his graduate student Xing Yang for their help in releasing process. This work has been supported in part by the Airforce Office of Scientific Research (Round Robin Program) through grant F 49629-97-1-0324, under the direction of Major Brian Sanders.
Group:GALCIT
Funders:
Funding AgencyGrant Number
Air Force Office of Scientific Research (AFOSR)F 49629-97-1-0324
Subject Keywords:Polysilicon, tensile test, mechanical properties, electrostatic grip, Atomic Force Microscopy, Digital Image Correlation, surface roughness, stiction
Record Number:CaltechAUTHORS:20180813-091037460
Persistent URL:http://resolver.caltech.edu/CaltechAUTHORS:20180813-091037460
Official Citation:Ioannis Chasiotis, Wolfgang G. Knauss, "Mechanical properties of thin polysilicon films by means of probe microscopy", Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); doi: 10.1117/12.324072; https://doi.org/10.1117/12.324072
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:88782
Collection:CaltechAUTHORS
Deposited By: George Porter
Deposited On:13 Aug 2018 17:59
Last Modified:13 Aug 2018 17:59

Repository Staff Only: item control page