Loh, Matthew and Emami-Neyestanak, Azita (2013) Capacitive proximity communication with distributed alignment sensing for origami biomedical implants. In: Proceedings of the IEEE 2013 Custom Integrated Circuits Conference. IEEE , Piscataway, NJ, pp. 1-4. ISBN 978-1-4673-6146-0. https://resolver.caltech.edu/CaltechAUTHORS:20190213-074612379
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Abstract
Origami implant design is a 3D integration technique which addresses size and cost constraints in biomedical implants. A capacitive proximity interconnect that enables this technique is presented. The interconnect embeds an alignment sensor that measures link quality directly and simplifies its adaptation to alignment. The sensor and transceiver share functional blocks, saving power and area. Data rates from 10-60 Mbps are achieved over 4-12 μm of parylene-C, with efficiencies up to 0.180 pJ/bit.
Item Type: | Book Section | |||||||||
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Additional Information: | © 2013 IEEE. The authors thank M. Monge for helpful technical discussions, K. Potter for advice on the test setup, J. Park and Y. Liu for parylene fabrication, STMicroelectronics for chip fabrication and the NSF for funding support. | |||||||||
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DOI: | 10.1109/CICC.2013.6658445 | |||||||||
Record Number: | CaltechAUTHORS:20190213-074612379 | |||||||||
Persistent URL: | https://resolver.caltech.edu/CaltechAUTHORS:20190213-074612379 | |||||||||
Official Citation: | M. Loh and A. Emami-Neyestanak, "Capacitive proximity communication with distributed alignment sensing for origami biomedical implants," Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, San Jose, CA, 2013, pp. 1-4. doi: 10.1109/CICC.2013.6658445 | |||||||||
Usage Policy: | No commercial reproduction, distribution, display or performance rights in this work are provided. | |||||||||
ID Code: | 92866 | |||||||||
Collection: | CaltechAUTHORS | |||||||||
Deposited By: | Tony Diaz | |||||||||
Deposited On: | 13 Feb 2019 19:05 | |||||||||
Last Modified: | 16 Nov 2021 16:54 |
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