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Parylene etching techniques for microfluidics and bioMEMS

Meng, Ellis and Tai, Yu-Chong (2005) Parylene etching techniques for microfluidics and bioMEMS. In: 18th IEEE International Conference on Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 568-571. ISBN 0-7803-8732-5. https://resolver.caltech.edu/CaltechAUTHORS:20190320-153133874

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Abstract

Parylene C (poly(monochloro-p-xylylene)) is a member of a unique family of thermoplastic, crystalline polymers. Compared to other polymers, parylene films are exceptionally conformal and chemically inert owing to its vapor deposition polymerization (VDP) coating process. These properties bring about many interesting possibilities for MEMS, particularly in microfluidic and bioMEMS applications. Dry etching techniques are required to define fine features in parylene films. For the first time, selective parylene C removal using oxygen-based plasmas is characterized for plasma etching, reactive ion etching (RIE), and deep reactive ion etching (DRIE) based methods. The ability of these techniques to achieve high aspect ratio (HAR) structures desirable for MEMS applications is also investigated.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/MEMSYS.2005.1453993DOIArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2005 IEEE. This work was supported in part by the Engineering Research Centers Program of the NSF under Award Number EEC-9402726. We would like to thank Mr. Trevor Roper and Mr. Damien Rodger for assistance in fabrication and Mr. Tuan Hoang for help with proofreading.
Funders:
Funding AgencyGrant Number
NSFEEC-9402726
DOI:10.1109/MEMSYS.2005.1453993
Record Number:CaltechAUTHORS:20190320-153133874
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20190320-153133874
Official Citation:E. Meng and Yu-Chong Tai, "Parylene etching techniques for microfluidics and bioMEMS," 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005. MEMS 2005., Miami Beach, FL, USA, 2005, pp. 568-571. doi: 10.1109/MEMSYS.2005.1453993
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:94009
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:20 Mar 2019 22:37
Last Modified:16 Nov 2021 17:02

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