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Q-enhanced fold-and-bond MEMS inductors

Chen, Po-Jui and Kuo, Wen-Cheng and Li, Wen and Yang, Yao-Joe and Tai, Yu-Chong (2008) Q-enhanced fold-and-bond MEMS inductors. In: 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems. IEEE , Piscataway, NJ, pp. 869-872. ISBN 9781424419074. https://resolver.caltech.edu/CaltechAUTHORS:20190322-120334732

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Abstract

This work presents a novel coil fabrication technology to enhance quality factor (Q factor) of microfabricated inductors for implanted medical wireless sensing and data/power transfer applications. Using parylene as a flexible thin-film device substrate, a post-microfabrication substrate folding-and-bonding method is developed to effectively increase the metal thickness of the surface-micromachined inductors, resulting in their lower self-resistance so their higher quality factor. One-fold-and-bond coils are successfully demonstrated as an example to verify the feasibility of the fabrication technology with measurement results in good agreements with device simulation. Depending on target specifications, multiple substrate folding-and-bonding can be extensively implemented to facilitate further improved electrical characteristics of the coils from single fabrication batch. Such Q- enhanced inductors can be broadly utilized with great potentials in flexible integrated wireless devices/systems for intraocular prostheses and other biomedical implants.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/nems.2008.4484461DOIArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2008 IEEE. This work was supported in part by the Engineering Research Centers Program of the National Science Foundation under NSF Award Number EEC-0310723.
Funders:
Funding AgencyGrant Number
NSFEEC-0310723
Subject Keywords:bonding; flexible; inductor; parylene; quality factor
Record Number:CaltechAUTHORS:20190322-120334732
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20190322-120334732
Official Citation:Po-Jui Chen, Wen-Cheng Kuo, Wen Li, Yao-Joe Yang and Yu-Chong Tai, "Q-enhanced fold-and-bond MEMS inductors," 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Sanya, 2008, pp. 869-872. doi: 10.1109/NEMS.2008.4484461
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:94057
Collection:CaltechAUTHORS
Deposited By: George Porter
Deposited On:25 Mar 2019 19:47
Last Modified:03 Oct 2019 21:00

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