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Underwater shear-stress sensor

Xu, Yong and Jiang, Fukang and Lin, Qiao and Clendenen, Jason and Tung, Steve and Tai, Yu-Chong (2002) Underwater shear-stress sensor. In: Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 340-343. ISBN 0-7803-7185-2. https://resolver.caltech.edu/CaltechAUTHORS:20190322-160808957

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Abstract

This paper reports the development of a micromachined, vacuum-cavity insulated, thermal shear-stress sensor for underwater applications. We focus on two major challenges for underwater shear-stress sensors: the waterproof coating and pressure sensitivity. It is found that thin-film CVD Parylene is a good waterproof material and sensors coated with 2 µm Parylene N can survive in water for at least one month at 55°C. It is also found that reducing the size and increasing the thickness of the sensor diaphragm are effective in minimizing the pressure sensitivity.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/memsys.2002.984272DOIArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2002 IEEE. This project is supported by the Office of Naval Research through an SBIR grant and the NSF Center for Neuromorphic System Engineering at Caltech.
Funders:
Funding AgencyGrant Number
Office of Naval Research (ONR)UNSPECIFIED
Center for Neuromorphic Systems Engineering, CaltechUNSPECIFIED
DOI:10.1109/memsys.2002.984272
Record Number:CaltechAUTHORS:20190322-160808957
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20190322-160808957
Official Citation:Yong Xu, Fukang Jiang, Qiao Lin, J. Clendenen, S. Tung and Yu-Chong Tai, "Underwater shear-stress sensor," Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266), Las Vegas, NV, USA, 2002, pp. 340-343. doi: 10.1109/MEMSYS.2002.984272
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:94080
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:22 Mar 2019 23:21
Last Modified:16 Nov 2021 17:02

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