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Micromachined high-aspect-ratio parylene beam and its application to low-frequency seismometer

Suzuki, Yuji and Tai, Yu-Chong (2003) Micromachined high-aspect-ratio parylene beam and its application to low-frequency seismometer. In: Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE , Piscataway, NJ, pp. 486-489. ISBN 0-7803-7744-3. https://resolver.caltech.edu/CaltechAUTHORS:20190326-104656500

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Abstract

A new microfabrication technology for high-aspect-ratio Parylene structure is developed for soft spring applications and applied to in-plane seismometer which covers low frequency (<1 Hz) and small acceleration range. Parylene beams having 10-40 /spl mu/m wide and an aspect ratio of 10-30 were successfully fabricated. Since Parylene has a small Young's modulus and is non-brittle material, high-aspect-ratio robust beam having spring constant on the order of 1 x 10^(-3) N/m was realized. A prototype capacitive seismometer was also made, and its resonant frequency and noise spectral density was respectively measured to be 37 Hz and 45 µg / √Hz Since the Brownian noise is only 25 ng µg / √Hz, seismometer having much lower noise floor may be feasible using this new technology.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/MEMSYS.2003.1189792DOIArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2003 IEEE. This work is supported by the NSF Engineering Research Center (ERC) at Caltech. YS acknowledges Professor N. Kasagi in the University of Tokyo for his support during the course of this work.
Funders:
Funding AgencyGrant Number
NSFUNSPECIFIED
University of TokyoUNSPECIFIED
DOI:10.1109/MEMSYS.2003.1189792
Record Number:CaltechAUTHORS:20190326-104656500
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20190326-104656500
Official Citation:Y. Suzuki and Yu-Chong Tai, "Micromachined high-aspect-ratio parylene beam and its application to low-frequency seismometer," The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE, Kyoto, Japan, 2003, pp. 486-489. doi: 10.1109/MEMSYS.2003.1189792
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:94143
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:26 Mar 2019 18:05
Last Modified:16 Nov 2021 17:03

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