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Flexible shear stress sensor skin for aerodynamics applications

Jiang, Fukang and Xu, Yong and Weng, Tianxiang and Han, Zhigang and Tai, Yu-Chong and Huang, Adam and Ho, Chih-Ming and Newbern, Scott (2000) Flexible shear stress sensor skin for aerodynamics applications. In: Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems. IEEE , Piscataway, NJ, pp. 364-369. ISBN 0780352734. https://resolver.caltech.edu/CaltechAUTHORS:20190409-152036983

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Abstract

Packaging for a large distributed sensing system is a challenging topic. Using flexible skin technology solves many of these problems. Combining with the newly developed backside contact technique, sensor packaging is made even easier by completely avoiding the fragile bonding wires. This paper describes the improved flexible MEMS technology and its application to the fabrication and packaging of practical shear stress sensor skins. An airflow separation detection system including these skins, MOSIS bias circuits and a data acquisition unit has been successfully tested in windtunnel and is being used for the aerodynamic study of a MEMS controlled super-maneuverable low-altitude unmanned aerial vehicle (UAV).


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1109/memsys.2000.838544DOIArticle
ORCID:
AuthorORCID
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2000 IEEE. This work is supported by DARPA under Navy Contract N66001-97-C-8610. The authors would like to thank Trevor Roper and Hung Bui for fabrication assistance, Chen-Wei Chiu from Umachines Inc. for electro less Nil Au plating, Dave Ganzer, Emil Ghapgharan and Mark Levoe for the UAV flight test.
Funders:
Funding AgencyGrant Number
Office of Naval Research (ONR)N66001-97-C-8610
Record Number:CaltechAUTHORS:20190409-152036983
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20190409-152036983
Official Citation:Fukang Jiang et al., "Flexible shear stress sensor skin for aerodynamics applications," Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308), Miyazaki, Japan, 2000, pp. 364-369. doi: 10.1109/MEMSYS.2000.838544
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:94605
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:09 Apr 2019 22:39
Last Modified:03 Oct 2019 21:05

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