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Robust parylene-to-silicon mechanical anchoring

Liger, Matthieu and Rodger, Damien C. and Tai, Yu-Chong (2003) Robust parylene-to-silicon mechanical anchoring. In: The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE. IEEE , Piscataway, NJ, pp. 602-605. ISBN 0780377443.

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This paper describes a new technique for strongly anchoring parylene (poly-para-xylylene) layers on a silicon substrate. Parylene has gained interest for MEMS applications due to its excellent properties. More specifically, because of its flexibility (Young's modulus of 4 GPa), its chemical barrier properties, its conformal deposition and its biocompatibility, parylene is of great interest for microfluidics and BioMEMS. One of the issues with parylene processing is adhesion and delamination problems, occurring during fabrication or during device operation. Here, we report a new technique for anchoring parylene films on silicon using DRIE-etched trenches and anchors. We demonstrate a new way to completely protect the adhesion of parylene even when exposed to aggressive chemicals.

Item Type:Book Section
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URLURL TypeDescription
Rodger, Damien C.0000-0002-1583-5946
Tai, Yu-Chong0000-0001-8529-106X
Additional Information:© 2003 IEEE. This work is supported by the NSF Center for Neuromorphic Engineering (CNSE) at Caltech.
Funding AgencyGrant Number
Center for Neuromorphic Systems Engineering, CaltechUNSPECIFIED
Record Number:CaltechAUTHORS:20190501-154134080
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Official Citation:M. Liger, D. C. Rodger and Yu-Chong Tai, "Robust parylene-to-silicon mechanical anchoring," The Sixteenth Annual International Conference on Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE, Kyoto, Japan, 2003, pp. 602-605. doi: 10.1109/MEMSYS.2003.1189821
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:95151
Deposited By: George Porter
Deposited On:01 May 2019 23:17
Last Modified:16 Nov 2021 17:10

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