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Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films

Wang, L. B. and Saira, O.-P. and Golubev, D. S. and Pekola, J. P. (2019) Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films. Physical Review Applied, 12 (2). Art. No. 024051. ISSN 2331-7019.

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We observe a crossover from electron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.

Item Type:Article
Related URLs:
URLURL TypeDescription Paper
Wang, L. B.0000-0001-5559-4879
Saira, O.-P.0000-0001-9715-0897
Alternate Title:Crossover between electron-phonon and boundary resistance limited thermal relaxation in copper films
Additional Information:© 2019 American Physical Society. Received 26 March 2019; revised manuscript received 29 July 2019; published 23 August 2019. We acknowledge the provision of the fabrication facilities by Otaniemi research infrastructure for micro and nanotechnologies (OtaNano). This work was performed as part of the Academy of Finland Centre of Excellence program (Project No. 312057) and the European Research Council (ERC) under the European Union’s Horizon 2020 research and innovation program (Grant No. 2742559 SQH).
Group:Kavli Nanoscience Institute
Funding AgencyGrant Number
Academy of Finland312057
European Research Council (ERC)2742559
Issue or Number:2
Record Number:CaltechAUTHORS:20190911-154315210
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Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:98590
Deposited By: Tony Diaz
Deposited On:11 Sep 2019 22:50
Last Modified:09 Mar 2020 13:19

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