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The Sensitivity of Cu for Electrochemical Carbon Dioxide Reduction to Hydrocarbons as Revealed by High Throughput Experiments

Lai, Yungchieh and Jones, Ryan J. R. and Wang, Yu and Zhou, Lan and Richter, Matthias H. and Gregoire, John M. (2019) The Sensitivity of Cu for Electrochemical Carbon Dioxide Reduction to Hydrocarbons as Revealed by High Throughput Experiments. Journal of Materials Chemistry A, 7 (47). pp. 26785-26790. ISSN 2050-7488. doi:10.1039/c9ta10111j. https://resolver.caltech.edu/CaltechAUTHORS:20191105-102648597

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Abstract

Electrochemical CO₂ reduction to valuable products is a centerpiece of future energy technologies that relies on identification of new catalysts. We present accelerated screening of Cu bimetallic alloys, revealing remarkable sensitivity to alloy concentration that indicates the migration of alloying elements to critical sites for hydrocarbon formation.


Item Type:Article
Related URLs:
URLURL TypeDescription
https://doi.org/10.1039/c9ta10111jDOIArticle
http://www.rsc.org/suppdata/c9/ta/c9ta10111j/c9ta10111j1.pdfPublisherSupplementary Information
https://doi.org/10.26434/chemrxiv.9961718.v1DOIDiscussion Paper
ORCID:
AuthorORCID
Lai, Yungchieh0000-0001-9392-1447
Jones, Ryan J. R.0000-0002-4629-3115
Wang, Yu0000-0003-3589-9274
Zhou, Lan0000-0002-7052-266X
Richter, Matthias H.0000-0003-0091-2045
Gregoire, John M.0000-0002-2863-5265
Additional Information:© 2019 The Royal Society of Chemistry. The article was received on 12 Sep 2019, accepted on 12 Nov 2019 and first published on 14 Nov 2019. Conflicts of interest: There are no conflicts to declare.
Group:JCAP
Subject Keywords:Carbon Dioxide Reduction Electrocatalysts Electrochemical conversion; High Throughput Screening
Issue or Number:47
DOI:10.1039/c9ta10111j
Record Number:CaltechAUTHORS:20191105-102648597
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20191105-102648597
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:99670
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:05 Nov 2019 18:33
Last Modified:01 Jun 2023 22:57

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