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Rapid Selective Annealing of Cu thin films on Si Using Microwaves

Brain, R. A. and Atwater, H. A. and Barmatz, M. (1994) Rapid Selective Annealing of Cu thin films on Si Using Microwaves. In: Microwave Processing of Materials IV. Materials Research Society Symposia Proceedings. No.347. Materials Research Society , Pittsburgh, PA, Art. No. 519. https://resolver.caltech.edu/CaltechAUTHORS:20191106-092843961

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Abstract

A key requirement for future integrated circuit fabrication is lower processing temperatures at all stages of fabrication. Typical rapid thermal annealing processes, utilizing infrared radiation, heat the film as well as the substrate and create the potential for device reliability problems. Microwave annealing may enable a novel solution to the problem of selective annealing of metallic or other conductive thin films, which is possible in the limit where the metal film thickness is less than the skin depth of the material at microwave frequencies. This technique is advantageous because the relatively low absorption of silicon deters substrate heating and the metallic thin film shields the rest of wafer. We have investigated the quality factor, Q, and temperature of silicon as a function of its doping concentration and power input into the microwave cavity. As a particular application of microwave selective annealing, we have microwave annealed sub-micron Cu thin films sputtered on patterned SiO₂/Si substrates and demonstrated an improvement in trench filling for use in interconnect metallization applications.


Item Type:Book Section
Related URLs:
URLURL TypeDescription
https://doi.org/10.1557/proc-347-519DOIArticle
ORCID:
AuthorORCID
Atwater, H. A.0000-0001-9435-0201
Additional Information:© 1994 Materials Research Society.
Series Name:Materials Research Society Symposia Proceedings
Issue or Number:347
Record Number:CaltechAUTHORS:20191106-092843961
Persistent URL:https://resolver.caltech.edu/CaltechAUTHORS:20191106-092843961
Official Citation:Brain, R., Atwater, H., & Barmatz, M. (1994). Rapid Selective Annealing of Cu thin films on Si Using Microwaves. MRS Proceedings, 347, 519. doi:10.1557/PROC-347-519
Usage Policy:No commercial reproduction, distribution, display or performance rights in this work are provided.
ID Code:99684
Collection:CaltechAUTHORS
Deposited By: Tony Diaz
Deposited On:06 Nov 2019 17:59
Last Modified:06 Nov 2019 17:59

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