Q-enhanced fold-and-bond MEMS inductors
This work presents a novel coil fabrication technology to enhance quality factor (Q factor) of microfabricated inductors for implanted medical wireless sensing and data/power transfer applications. Using parylene as a flexible thin-film device substrate, a post-microfabrication substrate folding-and-bonding method is developed to effectively increase the metal thickness of the surface-micromachined inductors, resulting in their lower self-resistance so their higher quality factor. One-fold-and-bond coils are successfully demonstrated as an example to verify the feasibility of the fabrication technology with measurement results in good agreements with device simulation. Depending on target specifications, multiple substrate folding-and-bonding can be extensively implemented to facilitate further improved electrical characteristics of the coils from single fabrication batch. Such Q-enhanced inductors can be broadly utilized with great potentials in flexible integrated wireless devices/systems for intraocular prostheses and other biomedical implants.
Additional Information© 2008 IEEE. This work was supported in part by the Engineering Research Centers Program of the National Science Foundation under NSF Award Number EEC-0310723.