Published June 2023 | Version public
Journal Article

An in-vivo preclinical study assessing biocompatibility of Pd-based bulk metallic glass Pd₇₉Ag_(3.5)P₆Si_(9.5)Ge₂

  • 1. ROR icon New York University
  • 2. ROR icon Icahn School of Medicine at Mount Sinai
  • 3. ROR icon California Institute of Technology
  • 4. ROR icon University of Miami

Abstract

Background: The bulk metallic glass (BMG), Pd₇₉Ag_(3.5)P₆Si_(9.5)Ge₂, has a high fracture toughness and has been found to accommodate post-yield stress, unlike most other BMG. Moreover, due to its greater noble gas composition it has a intrinsic corrosion resistance, ideal for dental and orthopedic implants. Objective: This present study aimed to evaluate the in vivo application of Pd₇₉Ag_(3.5)P₆Si_(9.5)Ge₂ in a large translational sheep model to assess its efficacy to be utilized as an endosteal device. Methods: Twelve implants in the form of cylindrical rods (3 mm in diameter) were produced through rapid quenching. Each sheep (n = 12) received one osteotomy in the mandibular region using rotary instrumentation, which was filled with Pd₇₉Ag_(3.5)P₆Si_(9.5)Ge₂. After 6- and 24-weeks the animals were euthanized, and samples collected en bloc to conduct histomorphometric analysis. The degree of osseointegration were assessed through bone-to-implant contact (BIC). Results: All samples revealed favorable BIC along with with fibrous connective tissue layers at both 6- and 24-weeks. Bone along with interfacial remodeling was observed in proximity with the metallic glass surface at 6 weeks with higher degrees of bone organization being observed at the later healing time, 24 weeks. Conclusions: The synthesized BMG, given its unique combination of toughness and strength, revealed potential to serve as an alternative to commonly used Ti alloys.

Additional Information

© 2023 IOS Press.

Additional details

Identifiers

Eprint ID
121686
Resolver ID
CaltechAUTHORS:20230602-251607000.26

Related works

Describes
10.3233/BME-221392 (DOI)

Dates

Created
2023-07-13
Created from EPrint's datestamp field
Updated
2023-07-13
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