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Published March 16, 2023 | v1
Journal Article Open

Strong Substrate Binding Modulates the Acoustic Quality Factors in Gold Nanodisks

Abstract

Lithographically prepared plasmonic nanoparticles are ideal mechanical probes, as their vibrational behavior can be precisely tuned through particle size and shape. But these particles exhibit strong intrinsic and extrinsic damping that results in small vibrational quality (Q) factors. Here, we perform single-particle transient transmission microscopy to investigate the effect of substrate-particle binding strength on the vibrational Q-factor of lithographically prepared gold nanodisks on glass. Weak and strong binding is realized through titanium adhesion layers of variable thickness. We find that strong binding leads to the generation of several new acoustic modes with varying Q-factors that depend on the particle aspect ratio and substrate material. Our work proposes an approach to tune enhanced acoustic Q-factors of lithographically prepared nanoparticles and offers a comprehensive description of their damping mechanism.

Copyright and License

© 2023 American Chemical Society.

Acknowledgement

Published as part of The Journal of Physical Chemistry C virtual special issue "Honoring Michael R. Berman".

This work was funded by the National Science Foundation, Center for Adapting Flaws into Features (NSF CHE-2124983). S.L. thanks the Robert A. Welch Foundation for support through the Charles W. Duncan, Jr.-Welch Chair in Chemistry (C-0002). C.F.L acknowledges funding from the Robert A. Welch Foundation (C-1787) and support through the Kenneth S. Pitzer-Schlumberger Chair in Chemistry. N.J.H. acknowledges funding from the Robert A. Welch Foundation (C-1220). L.A.M. acknowledges the National Science Foundation Research Fellowship Program (1842494) for support. This work was conducted in part using resources of the Shared Equipment Authority at Rice University.

Conflict of Interest

The authors declare no competing financial interest.
 

 

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Additional details

Created:
October 9, 2023
Modified:
October 9, 2023