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Published May 2011 | metadata_only
Journal Article

Successive Regeneration and Adaptive Cancellation of Higher Order Intermodulation Products in RF Receivers


In this paper, a general framework for the adaptive feedforward cancellation of higher order intermodulation distortion (IMD) products is presented. By generating only second-order and principal-odd-order IMD reference products in the RF/analog domain and reproducing higher order IMD reference products at digital baseband, the proposed reference distortion scheme minimizes the analog hardware burden on the system. Inherent in this procedure is an approximation that the profile of blocking signals causing IMD is dominated by one very large blocker. The limitations imposed by this approximation are quantitatively examined and shown to permit cancellation ratios of nearly the square of the ratio between the dominant and nondominant blocking signal RMS amplitudes. An experimental receiver employing the proposed technique was constructed utilizing a wide-swing low-noise transconductance amplifier in order to accommodate a rail-to-rail (+12.4 dBm) out-of-band blocker and a -16.3-dBm nondominant blocker. The measured receiver out-of-band 1-dB desensitization point is +12.5 dBm and the peak uncorrected two-tone third-order intermodulation intercept point (IIP3) is +33.5 dBm. Utilizing the proposed IMD cancellation scheme in the presence of a modulated dominant blocker improves the total input-referred IMD error power by over 24 dB, resulting in an extrapolated IIP3 metric of +43.5 dBm.

Additional Information

© 2011 IEEE. Manuscript received October 01, 2010; revised February 23, 2011; accepted February 23, 2011. Date of publication March 22, 2011; date of current version May 11, 2011. This paper is an expanded paper from the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, Anaheim, CA, May 23–28, 2010. The authors would like to thank UMC, Hsinchu, Taiwan, for fabrication of the RF/analog die, Cadence, San Jose, CA, for supplying design software, Zeland, Fremont, CA, for supplying the IE3D EM simulation package, the Rogers Corporation, Rogers, CT, for supplying dielectric substrates, and the Lee Center for Advanced Networking, Pasadena, CA, for funding. The authors would like to also thank H. Mani, Arizona State University, Tempe, for assembly assistance and J. Yoo, California Institute of Technology, Pasadena, and Dr. S. Kee, AyDeeKay LLC, Laguna Niguel, CA, for careful review of this paper's manuscript.

Additional details

August 22, 2023
August 22, 2023