Implantable RF-coiled chip packaging
In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years.
Additional Information© 2008 IEEE. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.