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Published January 2008 | Published
Book Section - Chapter Open

Implantable RF-coiled chip packaging


In this paper, we present an embedded chip integration technology that utilizes silicon housings and flexible parylene radio frequency (RF) coils. As a demonstration of this technology, a flexible parylene RF coil has been integrated with an RF identification (RFID) chip. The coil has an inductance of 16 μH, with two layers of metal completely encapsulated in parylene-C. The functionality of the embedded chip is verified using an RFID reader module. Accelerated-lifetime soak testing has been performed in saline, and the results show that the silicon chip is well protected and the lifetime of our parylene-encapsulated RF coil at 37 °C is more than 20 years.

Additional Information

© 2008 IEEE. This work is supported in part by the Engineering Research Center Program of the National Science Foundation under Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation (D.R.). The authors would also like to thank Mr. Trevor Roper and other members of the Caltech Micromachining Laboratory for assistance with fabrication.

Attached Files

Published - Li2008p8709Mems_2008_21St_Ieee_International_Conference_On_Micro_Electro_Mechanical_Systems_Technical_Digest.pdf



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August 19, 2023
January 12, 2024