Published December 15, 2017 | Version public
Journal Article

Narrow-Linewidth Oxide-Confined Heterogeneously Integrated Si/III–V Semiconductor Lasers

Abstract

We demonstrate a narrow-linewidth heterogeneously integrated Si/III-V laser, where the current confinement in the III-V structure is obtained by oxide isolation rather than by the prevailing ion-implantation technique. This method provides effective electrical isolation as well as III-V surface passivation, and a pathway for high-efficiency diode injection laser performance. This method also offers increased compatibility with potentially high-temperature annealing processes. The lasers shown here possess a threshold current of as low as 60 mA and a single-facet output power of more than 3 mW at 20 °C. A linewidth of 28 kHz at 1574.8 nm is obtained at a current of 200 mA (I = 3.3 × I_(th)). Single-mode operation is achieved with a side-mode suppression ratio larger than 55 dB.

Additional Information

© 2017 IEEE. Manuscript received August 23, 2017; revised October 31, 2017; accepted November 3, 2017. Date of publication November 8, 2017; date of current version November 17, 2017. This work was supported in part by DARPA MTO under Grant N66001-14-1-4062, and in part by the U.S. Army Research Office under Grant W911NF-16-C-0026 and Grant W911NF-14-P-0020. The authors would like to acknowledge technical and fabrication infrastructure support from the Kavli Nanoscience Institute at the California Institute of Technology.

Additional details

Identifiers

Eprint ID
84426
Resolver ID
CaltechAUTHORS:20180119-130456430

Funding

Defense Advanced Research Projects Agency (DARPA)
N66001-14-1-4062
Army Research Office (ARO)
W911NF-16-C-0026
Army Research Office (ARO)
W911NF-14-P-0020

Dates

Created
2018-01-19
Created from EPrint's datestamp field
Updated
2021-11-15
Created from EPrint's last_modified field

Caltech Custom Metadata

Caltech groups
Kavli Nanoscience Institute