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Published September 2005 | Published
Journal Article Open

Microelectronic packaging for retinal prostheses


The retinal prosthesis initiative at the Biomimetic Microelectronic Systems (BMES) center, an National Science Foundation (NSF) Engineering Research Center (ERC) at the University of Southern California (USC), the California Institute of Technology (Caltech), and the University of California, Santa Cruz, calls for a novel set of packaging technologies for bioimplant device construction. The testbed requires high-resolution electrical stimulation of the remaining functional neurons of the macula and a mechanically and electrically robust method for interconnecting application-specific integrated circuits (ASICs) with the interfacial electrodes. Our epiretinal prosthesis comprises a video-capture and data-encoding mechanism, a radio-frequency (RF) coil system for power and data transmission and recovery, an analog/digital ASIC with driving electronics, and a flexible retinotopic electrode array for neural stimulation, all in a chronically implantable, hermetically sealed package. Here, we discuss an innovative parylene-based high-density chip-level integrated interconnect (CL-I2) packaging system for retinal implants.

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"© 2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE." This work was supported in part by the Engineering Research Centers Program of the National Science Foundation under NSF Award Number EEC-0310723 and by a fellowship from the Whitaker Foundation.

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