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Published 2001 | public
Book Section - Chapter

BrF₃ Dry Release Technology for Large Freestanding Parylene MEMS


We report here a dry release technology for making large freestanding surface micromachined Parylene MEMS. The technology is a two-step process that combines wet photoresist dissolution with dry silicon etching by bromine trifluoride (BrF₃). With photoresist as the sacrificial layer dissolved using acetone, large Parylene MEMS devices can be achieved. A final dry release in BrF₃ vapor helps free the devices. For example, we have successfully fabricated freestanding 1-mm-long cantilevers, 2-mm-long bridges, and 2-mm-diameter diaphragms. These structures are suitable for fully integrated MEMS devices such as accelerometers, gyros and microphones.

Additional Information

© 2001 Springer-Verlag Berlin Heidelberg. The authors would like to thank Mr. Zhigang Han for some initial testing and Mr. Trevor Roper for fabrication assistance. This project is partially supported by NSF Engineering Research Center for Neuromorphic Engineering (CNSE) and DARPA under contract DABT 63-98-C-0005.

Additional details

August 21, 2023
October 19, 2023