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Suh, Jin-Yoo and Lohwongwatana, Boonrat and Garland, Carol M. et al. (2008) Novel thermoplastic bonding using a bulk metallic glass solder. Scripta Materialia, 59 (8). pp. 905-908. ISSN 1359-6462. doi:10.1016/j.scriptamat.2008.06.055. https://resolver.caltech.edu/CaltechAUTHORS:SUHsm08

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