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Kacsich, T. and Kolawa, E. and Fleurial, J. P. et al. (1998) Films of Ni–7 at% V, Pd, Pt and Ta–Si–N as diffusion barriers for copper on Bi2Te3. Journal of Physics D: Applied Physics, 31 (19). pp. 2406-2411. ISSN 0022-3727. http://resolver.caltech.edu/CaltechAUTHORS:KACjpd98

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