A Caltech Library Service

Items where Person is "Hong-Sankgi"

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Date | Item Type | First Author | No Grouping
Jump to: Book Section
Number of items: 1.

Book Section

Hong, Jaesub and Allen, Branden and Grindlay, Jonathan et al. (2017) Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays. In: Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XIX. Proceedings of SPIE. No.10392. Society of Photo-Optical Instrumentation Engineers , Bellingham, WA, Art. No. 103920U.

This list was generated on Thu Dec 3 22:40:39 2020 PST.