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2017

Hong, Jaesub and Allen, Branden and Grindlay, Jonathan et al. (2017) Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays. In: Hard X-Ray, Gamma-Ray, and Neutron Detector Physics XIX. Proceedings of SPIE. No.10392. Society of Photo-Optical Instrumentation Engineers , Bellingham, WA, Art. No. 103920U. https://resolver.caltech.edu/CaltechAUTHORS:20180108-153821651

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