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Published August 2010 | Published
Journal Article Open

Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses


This paper presents an embedded chip integration technology that incorporates silicon housings and flexible Parylene-based microelectromechanical systems (MEMS) devices. Accelerated-lifetime soak testing is performed in saline at elevated temperatures to study the packaging performance of Parylene C thin films. Experimental results show that the silicon chip under test is well protected by Parylene, and the lifetime of Parylenecoated metal at body temperature (37°C) is more than 60 years, indicating that Parylene C is an excellent structural and packaging material for biomedical applications. To demonstrate the proposed packaging technology, a flexible MEMS radio-frequency (RF) coil has been integrated with an RF identification (RFID) circuit die. The coil has an inductance of 16 μH with two layers of metal completely encapsulated in Parylene C, which is microfabricated using a Parylene–metal–Parylene thin-film technology. The chip is a commercially available read-only RFID chip with a typical operating frequency of 125 kHz. The functionality of the embedded chip has been tested using an RFID reader module in both air and saline, demonstrating successful power and data transmission through the MEMS coil.

Additional Information

© 2010 IEEE. Manuscript received January 7, 2010; revised March 23, 2010; accepted April 26, 2010. Date of publication June 14, 2010; date of current version July 30, 2010. This work was supported in part by the Engineering Research Center Program of the National Science Foundation under Award EEC-0310723 and in part by a fellowship from the Whitaker Foundation (D.R.). Subject Editor S. Shoji. The authors would also like to thank T. Roper and other members of the Caltech Micromachining Laboratory for the assistance with fabrication.

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Published - Li2010p11833J_Microelectromech_S.pdf


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